National University of Kaohsiung /  Prof. Jui-Yang, Feng and Prof. Hung-Yin Lin

 Pain Points Solved 

Technical Summary
This technology combines Selective Etching with Supercritical CO2 (scCO2) Treatment.
 It takes a two-dimensional (2D) material, which resembles a stack of ultra-thin paper, creates microscopic slits through etching, and then utilizes supercritical carbon dioxide to expand these gaps. This process creates numerous straight, unobstructed micro-channels that reduce impurities and allow electricity, heat, ions, or water/gas molecules to pass through more easily.
This technology is directly applicable to fields such as energy storage, membrane separation, and conductive/shielding coatings. Compared to traditional processes—which rely solely on acid etching, prolonged water washing, and high-temperature drying—this method penetrates deep into microscopic crevices to "expand the path and carry away contaminants"6666. It shortens cleaning times, reduces residual impurities like fluorine and aluminum, and maintains structural integrity under mild conditions, making it ideal for mass production7.

Why It Surpasses Existing Methods
•    Superior Uniformity: scCO2 penetrates extremely fine crevices, ensuring consistent treatment throughout the entire bulk material.
•    Gentler Conditions: Avoids harsh high-temperature treatments, preventing damage to the delicate material structure.
•    Higher Efficiency: Significantly accelerates the cleaning process and shortens the overall production cycle from 24 hours down to 2–6 hours.
•    Eco-Friendly: Reduces the consumption of chemical reagents and wastewater generation; CO2 is also recyclable.
•    Scalability: The modular process (Treatment → Cleaning) is easily integrated and scaled up for industrial production lines.

 Technology Introduction 

1. Core Technical Principles
This technology utilizes a two-stage process: first, a two-dimensional (2D) inorganic material undergoes preliminary etching. Subsequently, Supercritical Carbon Dioxide (scCO2) is introduced. 
Leveraging the high permeability of supercritical fluids, the process aids the etching agent (such as hydrofluoric acid) in penetrating the interlayers of the material. 
Upon pressure release, a "foaming effect" occurs, driving the structure to expand and unfurl.

2. Key Problems Solved
Excessive Processing Time: Traditional wet etching typically requires over 24 hours and often fails to achieve complete delamination 6; this technology shortens the duration to just 2 to 6 hours.
High Chemical Consumption: Conventional methods demand large quantities of high-concentration chemicals 8888; this technology achieves superior results with lower dosages.
Non-uniform Delamination: Traditional processes frequently leave behind residual bulk structures ; supercritical treatment produces a prominent and uniform "accordion-like" layered structure.

3. Technical Value and Advantages
Enhanced Quality: X-ray diffraction (XRD) analysis demonstrates that materials treated with this method exhibit sharper crystalline features, indicating superior material quality compared to traditional methods.
Precision Control: Research confirms 4 hours as the optimal treatment time, achieving the lowest aluminum content without damaging the titanium matrix.
Environmental Safety: By reducing chemical usage and simplifying the workflow, the technology enhances laboratory safety and reduces environmental impact.

4. Industrial Applications
The high-quality 2D materials produced by this technology are suitable for the following fields
Semiconductors: Wafers and microelectronic components.
Energy Storage: Supercapacitors and battery electrodes.
Environmental Engineering: Desalination and environmental monitoring.
Advanced Materials: Electromagnetic interference (EMI) shielding and transparent conductive films.

 Application Examples 

1. Energy Storage:
Applications: Electrodes for supercapacitors and Lithium/Sodium/Zinc-ion batteries.
Benefits: Achieves faster charging/discharging and more stable cycling performance due to the expanded "accordion-like" structure.

2. Conductive, Shielding, and Heat Dissipation:
Applications: Electromagnetic interference (EMI) shielding films, conductive coatings, and thermal interface materials (TIMs).
Benefits: Enables thinner, more conductive layers with more effective heat dissipation capabilities.

3. Water Treatment and Separation Membranes:

Applications: Desalination, dye/heavy metal removal, and gas separation.
Benefits: The adjustable interlayer channels (pores) balance high flux with precise selectivity.

4. Sensing and Catalysis:
Applications: Electrochemical sensing and catalytic efficiency enhancement.
Benefits: Provides more effective active sites, significantly improving electrochemical reaction rates.

 Related Links 

None

 Patent Name and Number 

FENG, JUI YANG (TW);
LIN, HUNG YIN (TW);
LEE, MEI HWA (TW);
WANG, CHUN HUNG (TW);
FANG, XI JUN (TW)

SUPERCRITICAL FLUIDS (SCFs) TREATMENT OF TWO-DIMENSIONAL INORGANIC COMPOUND STRUCTURE AND METHOD THEREOF

Taiwan patent I903293，2025/11/01 - 2043/11/30

 Industry-Academia / Tech Transfer Partner 

None

 Honors and Awards  

None

 Technical Contact  

Vivian Lee, Administrative Assistant 

National University of Kaohsiung
Tel: +886 7-5916639
Email: vivianlee@nuk.edu.tw